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Semiconductor Components Industries, LLC, 2009
August, 2009 ?
Rev. 3
1
Publication Order Number:
MMBD6100LT1/D
MMBD6100LT1G
Monolithic Dual
Switching Diode
Features
?
These Devices are Pb?Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS (EACH DIODE)
Rating
Symbol
Value
Unit
Reverse Voltage
VR
70
Vdc
Forward Current
IF
200
mAdc
Peak Forward Surge Current
IFM(surge)
500
mAdc
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Total Device Dissipation, FR?5 Board
(Note 1)
TA
= 25
°C
Derate above 25°C
PD
225
1.8
mW
mW/°C
Thermal Resistance, Junction?to?Ambient
RJA
556
°C/W
Total Device Dissipation Alumina Substrate
(Note 2)
TA
= 25
°C
Derate above 25°C
PD
300
2.4
mW
mW/°C
Thermal Resistance, Junction?to?Ambient
RJA
417
°C/W
Junction and Storage Temperature Range
TJ, Tstg
?55 to +150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR?5 = 1.0
0.75
0.062 in.
2. Alumina = 0.4
0.3
0.024 in. 99.5% alumina.
ELECTRICAL CHARACTERISTICS (TA
= 25
°C unless otherwise noted)
Characteristic
Symbol
Min
Max
Unit
OFF CHARACTERISTICS
Reverse Breakdown Voltage
(I(BR)
= 100
Adc)
V(BR)
70
?
Vdc
Reverse Voltage Leakage Current
(VR
= 50 Vdc)
(For each individual diode while the
second diode is unbiased)
IR
?
0.1
Adc
Forward Voltage
(IF
= 1.0 mAdc)
(IF
= 100 mAdc)
VF
0.55
0.8
0.7
1.1
Vdc
Reverse Recovery Time
(IF
= I
R
= 10 mAdc, I
R(REC)
= 1.0 mAdc)
(Figure 1)
trr
?
4.0
ns
Capacitance
(VR
= 0 V)
C
?
2.5
pF
Device Package Shipping?
ORDERING INFORMATION
SOT?23
CASE 318
STYLE 9
3
CATHODE
2
ANODE
ANODE
1
1
5B M
5B = Specific Device Code
M = Date Code*
= Pb?Free Package
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
MMBD6100LT3G SOT?23
(Pb?Free)
10,000/Tape & Reel
3000/Tape & Reel
MMBD6100LT1G SOT?23
(Pb?Free)
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
http://onsemi.com
(Note: Microdot may be in either location)
1
2
3
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